COB LED Display VS GOB LED Display

What is GOB LED display?

GOB is glue on board, which is used to obtain a high protection LED display, which is a new technology similar to module packaging. It is working with the entire display module (for example, 250*250mm) by covering the surface of the PCB board of the module with a patented transparent glue, on which thousands of SMD lamps have been soldered, and finally the module has obtained a special shielding layer on its surface.

It has a high protection LED display, which is able to achieve anti-collision (anti-collision), dustproof, waterproof, moisture-proof, UV-proof, and has no harmful effects on heat dissipation and brightness loss. Long-term rigorous testing has shown that the shielding glue even helps heat dissipation, thereby extending the service life.

The revolutionary change that drives the development of the entire LED display industry is that this GOB display is aimed at fine-pitch LED displays and rental screens, which have a natural requirement for the protection of LED diodes.

What is COB LED display?

COB is chip on board, which is a different chip packaging technology, all chips are directly integrated and packaged on a special PCB board, and the packaging technology we are talking about is the integration of three RGB led chips into the SMD electronic package to produce a single SMD diode.

On the surface, COB sounds similar to GOB display technology, but it has a longer development history and has recently been adopted in promotional products of some major manufacturers.

Wide viewing angle, high color uniformity, high contrast, high power efficiency, etc. are the same characteristics as traditional led technology. The most important thing is to use COB to obtain high protection performance, such as avoiding collision, moisture and dust, in short, higher environmental adaptability, this Nanoshi led coating technology obtains pixel-level protection.

Obviously, COB technology will also obtain the same high protection display as GOB. In addition to the cost, COB also has risks in the wavelength and color separation and the picking process of all chips on the board, which makes it difficult to obtain perfect color uniformity for the entire display. However, GOB can obtain good color uniformity because the module is manufactured and tested in the same traditional way as ordinary modules before special gluing. The maintenance of COB is also a pressing issue.

As well as its own Delta enhanced COB technology, which provides high brightness for small pitch LED displays, three times that of most high-resolution LED displays (up to 3000Nits). It uses micro-LEDs by placing three discrete red, green and blue single-color micro-LEDs on the board.

Due to the small size of COB LED displays, there is no diameter of each LED. This makes the production process easy and less expensive. COB displays pride themselves on heat resistance with high-density packaging.

Compared to SMD and DIP, COB LEDs are easy to install. Its ultra-thin PCB board makes for a lightweight LED that is very convenient wherever the buyer wishes to carry it. This type of display encapsulates LED chips on the board, which are cured with the help of epoxy glue. The best part of COB displays is that it can dissipate heat through the copper foil on the board.

Another important consideration is its anti-corrosion, anti-static, waterproof, anti-oxidation, dust-proof and moisture-proof features, making this LED an important purchase for various purposes.

In the future, the mainstream display technology is micro-pitch Micro-LED. Theoretically, the pixel pitch can be infinitely small. It is a fine-pitch display technology based on COB packaging.